Two-dimensional is flat, and three-dimensional is solid.
Originally, transistors were "etched" onto silicon wafers using photolithography. Changing to three-dimensional would be similar to "building" transistors onto the chip.
The technical difficulty of this is obviously increased many times over.
"The multiple exposure technology I developed earlier seems to be perfectly suitable for the photolithography of 3D transistors. Let's try it first."
Without complex application processes, without communication, and without resource collection, Tom had just obtained this possibility one second, and the next second, he made a direct decision.
Thus, many Clones who were trying other solutions immediately put down their work and all joined in the attempt of this possibility.
The relevant resources needed for this attempt were immediately in place, without any delay, and the entire process was extremely efficient.
